Structural Design (Physical Design) Engineer Internship in Bengaluru Bangalore

Job Description:

This role is for experienced Individual contributor for Physical design, using Synthesis -Automatic Placement and Route flow, from RTL to GDS , including sign off for Timing, Reliability and Layout verification, using Industry standard tools for APR partitions with high frequency targets.

Candidate is expected to work on Synthesis, Floor planning, Placement, Clock Tree Synthesis, Routing, Timing convergence, Scan, Hard Macro integration, and Physical convergence. Candidate will be collaborating for, constraint development, flow optimization to meet design requirements, by working with RTL developers, CAD team and EDA vendors

Qualifications:

Minimum qualifications are required to be initially considered for this position.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications:

The candidate must have a Bachelor's degree in Computer/Electrical Engineering or Computer Science and 4+ years of experience

a Master's Degree in Computer/Electrical Engineering or Computer Science and 2+ years of experience 

a PhD in Computer/Electrical Engineering or Computer Science and 1+ year of experience with the following: Experience with owning the full chip level and taping out multiple complex SoCs Hands-on experience with industry standard Cadence or Synopsys tool suite, and other Sign-off tools from Siemens (Mentor), Ansys etc.

Must have good understanding on all or some of Full-Chip Level Partitioning, Floorplanning, PnR, CTS, different clocking techniques for skew and delay balancing, multiple clock complexity, time budgeting, timing closure techniques, PnR congestion analysis, resolving floorplanning issues, UPF (Low power design techniques), resolving formal verification, layout physical problems, understanding and hand-on experience of digital design sign-off tools like and not limited to noise analysis, layout closure, timing and functional eco closure, IR drop analysis etc.

In-depth understanding on rtl to gds2 flow and understanding of basic device physics.

The candidate should have the minimum proficiency with basic scripting with tcl, perl, shell etc. to solve the basic design problem Past experience with internal flow development and understand nuances of Physical Design (Structural Design) flow.

Working experience with cutting edge technology (7nm or below)

Preferred Qualifications:

Experience with handling developing PDKs (Process Design Kit) Strong scripting proficiency in PERL, tcl Good handle on Tape-out interaction with the foundry and worked on Post-Silicon activities Exposure to various industry standard Physical Design and Sign-Off closure tools Understanding of peer domains to Physical Design, viz., RTL, verification, DFx, post-Si etc.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Inside this Business GroupIntel Foundry Services (IFS) is an independent foundry business that is established to meet our customers unique product needs. With the first Open System Foundry model in the world, our combined offerings of wafer fabrication, advanced process, and packaging technology, chiplet, software, robust ecosystem, and assembly and test capabilities help our customers build their innovative silicon designs and deliver full end-to-end customizable products from Intel's secure, resilient and sustainable source of supply.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.

Find more information about all of our Amazing Benefits.

It has come to our notice that some people have received fake job interview letters ostensibly issued by Intel, inviting them to attend interviews in Intel's o ffices for various positions and further requiring them to deposit money to be eligible for the interviews. We wish to bring to your notice that these letters are not issued by Intel or any of its authorized representatives. Hiring at Intel is based purely on merit and Intel does not ask or require candidates to deposit any money. We would urge people interested in working for Intel, to apply directly at https://jobs.intel.com/ and not fall prey to unscrupulous elements.

Working Model:

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.